DBS Fintech Scholarship

​​​​​​​DBS Fintech Scholarship

PURPOSE

To support local Hong Kong students’ career development in Fintech and recognize those who, based on their academic achievements, aspiration on development and application of Fintech in banking sector, ability, ambition and determination to contribute a big and positive impact on Hong Kong FinTech community.

Eligibility

1. Hong Kong permanent residents,  full-time and part-time Year 1 of the MSc Programme in Financial Technology, Faculty of Engineering, CUHK are eligible for application;
2. Applicants must submit a presentation on their views on the development and application of Fintech in banking sector in Hong Kong, and how would they contribute to Hong Kong Fintech development after graduation;
3. Applicants should have attained a cumulative GPA of 3.3 or above (by Term 1 of the academic year 2020/21)

Scholarship Amount and Quota

The scholarship amount is HK$50,000.  There will be 1 scholarship to be conferred in each academic year.

Application Procedures

Applicants should submit the completed application form, grade report and PowerPoint deck in person or by mail to the Faculty Office, Faculty of Engineering in Jan 2021. (Exact date will be announced later)

Selection

The Dean of Faculty of Engineering will be invited to nominate 5 suitable candidates for the scholarship, and particulars of the candidates should be sent to the donor for a final decision.
The donor reserves the right to adjust the final number of awards.